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TSM4NC50CP Arkusz danych(PDF) 1 Page - Taiwan Semiconductor Company, Ltd

Numer części TSM4NC50CP
Szczegółowy opis  100% UIS and Rg tested
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Producent  TSC [Taiwan Semiconductor Company, Ltd]
Strona internetowa  http://www.taiwansemi.com
Logo TSC - Taiwan Semiconductor Company, Ltd

TSM4NC50CP Arkusz danych(HTML) 1 Page - Taiwan Semiconductor Company, Ltd

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TSM4NC50CP
Taiwan Semiconductor
1
Version: A1609
N-Channel Power MOSFET
500V, 4A, 2.7
Ω
FEATURES
● 100% UIS and Rg tested
● Advanced planar process
● Compliant to RoHS Directive 2011/65/EU and in
accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PERFORMANCE PARAMETERS
PARAMETER
VALUE
UNIT
VDS
500
V
RDS(on) (max)
2.7
Ω
Qg
12
nC
APPLICATIONS
● AC/DC LED Lighting
● Power Supply
● Charger
TO-252 (DPAK)
Notes: MSL 3 (Moisture Sensitivity Level) per J-STD-020
ABSOLUTE MAXIMUM RATINGS (T
A = 25°C unless otherwise noted)
PARAMETER
SYMBOL
Limit
UNIT
Drain-Source Voltage
VDS
500
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current
(Note 1)
TC = 25°C
ID
4
A
TC = 100°C
2.5
Pulsed Drain Current
(Note 2)
IDM
16
A
Total Power Dissipation @ TC = 25°C
PDTOT
83
W
Single Pulse Avalanche Energy
(Note 3)
EAS
78.4
mJ
Single Pulse Avalanche Current
(Note 3)
IAS
2.8
A
Operating Junction and Storage Temperature Range
TJ, TSTG
- 55 to +150
°C
THERMAL PERFORMANCE
PARAMETER
SYMBOL
Limit
UNIT
Junction to Case Thermal Resistance
RӨJC
1.5
°C/W
Junction to Ambient Thermal Resistance
RӨJA
62
°C/W
Thermal Performance Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case-
thermal reference is defined at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is
determined by the user’s board design. RӨJA shown below for single device operation on FR-4 PCB in still air.


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