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ATWILC1000B-MUT Arkusz danych(PDF) 2 Page - ATMEL Corporation

Numer części ATWILC1000B-MUT
Szczegółowy opis  IEEE 802.11 b/g/n Link Controller SoC
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Producent  ATMEL [ATMEL Corporation]
Strona internetowa  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

ATWILC1000B-MUT Arkusz danych(HTML) 2 Page - ATMEL Corporation

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ATWILC1000B-MUT [DATASHEET]
Atmel-42491B-ATWILC1000B-MUT_Datasheet_03/2016
2
2
T a b l e o f C o n t e n t s
1
Ordering Information and IC Marking ........................................................................ 4
2
Block Diagram ............................................................................................................. 4
3
Pinout and Package Information ................................................................................ 4
3.1
Pin Description ......................................................................................................................................4
3.2
Package Description .............................................................................................................................7
4
Electrical Specifications ........................................................................................... 11
4.1
Absolute Ratings ................................................................................................................................. 11
4.2
Recommended Operating Conditions ................................................................................................. 11
4.3
DC Electrical Characteristics ............................................................................................................... 12
5
Clocking ................................................................................................................... 13
5.1
Crystal Oscillator ................................................................................................................................. 13
5.2
Low-Power Oscillator .......................................................................................................................... 14
6
CPU and Memory Subsystems ................................................................................. 15
6.1
Processor ............................................................................................................................................ 15
6.2
Memory Subsystem............................................................................................................................. 15
6.3
Non-volatile Memory (eFuse) .............................................................................................................. 15
7
WLAN Subsystem...................................................................................................... 16
7.1.1
Features ................................................................................................................................. 16
7.1.2
Description.............................................................................................................................. 16
7.2
PHY
.............................................................................................................................................. 17
7.2.1
Features ................................................................................................................................. 17
7.2.2
Description.............................................................................................................................. 17
7.3
Radio
.............................................................................................................................................. 17
7.3.1
Receiver Performance ............................................................................................................ 17
7.3.2
Transmitter Performance ........................................................................................................ 19
8
External Interfaces .................................................................................................... 20
8.1
I2C Slave Interface .............................................................................................................................. 20
8.2
I2C Master Interface ............................................................................................................................ 21
8.3
SPI Slave Interface.............................................................................................................................. 22
8.4
SPI Master Interface............................................................................................................................ 24
8.5
SDIO Slave Interface........................................................................................................................... 25
8.6
UART
.............................................................................................................................................. 27
8.7
Wi-Fi/Bluetooth Coexistence ............................................................................................................... 28
8.8
GPIOs
.............................................................................................................................................. 28
9
Power Management ................................................................................................... 29
9.1
Power Architecture .............................................................................................................................. 29
9.2
Power Consumption ............................................................................................................................ 30
9.2.1
Description of Device States................................................................................................... 30
9.2.2
Current Consumption in Various Device States...................................................................... 30
9.2.3
Restrictions for Power States ................................................................................................. 31
9.3
Power-Up/Down Sequence ................................................................................................................. 31
9.4
Digital I/O Pin Behavior during Power-Up Sequences......................................................................... 32


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