NCV47821_17 datasheet(4/15 Pages) ONSEMI

Numer części	NCV47821

Szczegółowy opis	Adjustable Dual LDO with Adjustable Current Limit and Diagnostic Features

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Producent	ONSEMI [ON Semiconductor]

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NCV47821

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Table 2. MAXIMUM RATINGS

Rating

Symbol

Min

Max

Unit

Input Voltage DC

Vin

−42

45

V

Input Voltage (Note 1)

Load Dump − Suppressed

Us*

−

60

V

Enable Input Voltage

VEN1,2

−42

45

V

ADJ Input Voltage

VADJ1,2

−0.3

10

V

CSO Voltage

VCSO1,2

−0.3

7

V

DE, CS and EF Voltages

VDE, VCS VEF

−0.3

7

V

Output Voltage

Vout1,2

−1

40

V

Junction Temperature

TJ

−40

150

°C

Storage Temperature

TSTG

−55

150

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in

production. Passed Class C according to ISO16750−1.

Table 3. ESD CAPABILITY (Note 2)

Rating

Symbol

Min

Max

Unit

ESD Capability, Human Body Model

ESDHBM

−2

2

kV

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)

Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due

to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform

characteristic defined in JEDEC JS−002−2014.

Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3)

Rating

Symbol

Min

Max

Unit

Moisture Sensitivity Level

MSL

1

−

3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

THERMAL CHARACTERISTICS (Note 4)

Rating

Symbol

Value

Unit

Thermal Characteristics (single layer PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

52

9.0

°C/W

Thermal Characteristics (4 layers PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

31

10

°C/W

4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,

4 layers − according to JEDEC51.7

Table 5. RECOMMENDED OPERATING RANGES

Rating

Symbol

Min

Max

Unit

Input Voltage (Note 6)

Vin

4.4

40

V

Nominal Output Voltages

Vout_nom1,2

3.3

20

V

Output Current Limit (Note 7)

ILIM1,2

10

300

mA

Junction Temperature

TJ

−40

150

°C

Current Sense Output (CSO) Capacitor

CCSO1,2

1

4.7

mF

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

6. Minimum Vin = 4.4 V or (Vout1,2 + 0.5 V), whichever is higher.

7. Corresponding RCSO1,2 is in range from 25.5 kW down to 850 W.

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