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ACT4529M Arkusz danych(PDF) 3 Page - Active-Semi, Inc |
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ACT4529M Arkusz danych(HTML) 3 Page - Active-Semi, Inc |
3 / 15 page ACT4529M Rev 1, 23-Feb-17 Innovative PowerTM - 3 - www.active-semi.com Copyright © 2016-2017 Active-Semi, Inc. ABSOLUTE MAXIMUM RATINGS PARAMETER VALUE UNIT IN to GND -0.3 to 40 V SW to GND -1 to VIN +1 V HSB to GND VSW - 0.3 to VSW + 7 V CSP, CSN to GND -0.3 to +15 V Junction to Ambient Thermal Resistance 46 °C/W Operating Junction Temperature -40 to 150 °C Storage Junction Temperature -55 to 150 °C Lead Temperature (Soldering 10 sec.) 300 °C All other pins to GND -0.3 to +6 V PDC to GND -0.3 to +6 V : Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability. PIN DESCRIPTIONS PIN NAME DESCRIPTION 1 CSP Voltage Feedback Input. Connect to node of the inductor and output capacitor. CSP and CSN Kevin sense is recommended. 2 CSN Negative input terminal of output current sense. Connect to the negative terminal of current sense resistor. 3 PDC USB-PD Control Pin. floating: 5.1V, pulled high: 12.1V, pulled low: 9.1V. Do not drive this pin higher than 5V. 4 DP Data Line Positive Input. Connected to D+ of attached portable device data line. This pin passes 8kV HBM ESD. 5 DM Data Line Negative Input. Connected to D- of attached portable device data line. This pin passes 8kV HBM ESD. 6 IN Power Supply Input. Bypass this pin with a 10μF ceramic capacitor to GND, placed as close to the IC as possible. 7 SW Power Switching Output to External Inductor. 8 HSB High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver. Connect a 22nF capacitor from HSB pin to SW pin. 9 GND Ground and Heat Dissipation Pad. Connect this exposed pad to large ground copper area with copper and vias. |
Podobny numer części - ACT4529M |
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Podobny opis - ACT4529M |
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