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LTM4651 Arkusz danych(PDF) 27 Page - Linear Technology |
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LTM4651 Arkusz danych(HTML) 27 Page - Linear Technology |
27 / 34 page LTM4651 27 4651f For more information www.linear.com/LTM4651 Figure 28. 5V to –24V Derating Curve, with BGA Heat Sink Figure 29. 12V to –24V Derating Curve, with BGA Heat Sink Figure 30. 24V to –24V Derating Curve, with BGA Heat Sink APPLICATIONS INFORMATION—DERATING CURVES APPLICATIONS INFORMATION Safety Considerations The LTM4651 does not provide galvanic isolation from VIN to VOUT–. There is no internal fuse. If required, a slow blow fuse with a rating twice the maximum input current needs to be provided to protect the unit from catastrophic failure. The fuse or circuit breaker, if used, should be selected to limit the current to the regulator in case of a MT MOSFET fault. If MT fails, the system’s input supply will source very large currents to PGND through MT. This can cause excessive heat and board damage depending on how much power the input voltage can deliver to this system. A fuse or circuit breaker can be used as a secondary fault protector in this situation. The LTM4651 does feature overcurrent and overtemperature protection. Layout Checklist/Example The high integration of LTM4651 makes the PCB board layout straightforward. However, to optimize its electrical and thermal performance, some layout considerations are still necessary. • Use large PCB copper areas for high current paths, including VIN, PGND and VOUT–. Doing so helps to minimize the PCB conduction loss and thermal stress. • Place high frequency ceramic input and output (and, if used, input-to-output) capacitors next to the VIN, VD, PGNDandVOUT–pinstominimizehighfrequencynoise. • Place a dedicated power ground layer underneath the LTM4651. • To minimize the via conduction loss and reduce module thermal stress, use multiple vias for interconnection between top layer and other power layers. • Do not put vias directly on pads, unless they are capped or plated over. • Use a separate SVOUT– copper plane for components connected to signal pins. Connect SVOUT– to VOUT– directly under the module. • For parallel module applications, connect the VOUT–, GNDSNS,RUN,ISETa,COMPaandPGOODpinstogether as shown in Figure 41. • Bring out test points on the signal pins for monitoring. Figure 31 gives a good example of the recommended LTM4651 layout. 0LFM 200LFM 400LFM AMBIENT TEMPERATURE (°C) 20 40 60 80 100 120 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 4651 F28 0LFM 200LFM 400LFM AMBIENT TEMPERATURE (°C) 20 40 60 80 100 120 0 0.125 0.250 0.375 0.500 0.625 0.750 0.875 1.000 1.125 1.250 4651 F29 0LFM 200LFM 400LFM AMBIENT TEMPERATURE (°C) 20 40 60 80 100 120 0 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 4651 F30 |
Podobny numer części - LTM4651 |
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Podobny opis - LTM4651 |
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