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LTM4661 Arkusz danych(PDF) 16 Page - Linear Technology |
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LTM4661 Arkusz danych(HTML) 16 Page - Linear Technology |
16 / 20 page LTM4661 16 4661f For more information www.linear.com/LTM4661 Figure 15 shows a measured thermal picture of the LTM4661 running from 3.3V input to 12V output at 0.8A DC current with 200LFM airflow and no heat sink. Figure 15. Thermal Image, 3.3V Input to 12V Output at 0.8A, 200LFM Air Flow, No Heat Sink Safety Considerations The LTM4661 modules do not provide galvanic isolation from VIN to VOUT. There is no internal fuse. If required, a slow blow fuse with a rating twice the maximum input current needs to be provided to protect each unit from catastrophic failure. The device does support thermal shutdown and overcurrent protection. Layout Checklist/Example The high integration of LTM4661 makes the PCB board layoutverysimpleandeasy.However,tooptimizeitselectri- cal and thermal performance, some layout considerations are still necessary. • Use large PCB copper areas for high current paths, including VIN, GND and VOUT. It helps to minimize the PCB conduction loss and thermal stress. • Placehighfrequencyceramicinputandoutputcapaci- tors next to the VIN, PGND and VOUT pins to minimize high frequency noise. • Place a dedicated power ground layer underneath the unit. • Tominimizetheviaconductionlossandreducemodule thermal stress, use multiple vias for interconnection between top layer and other power layers. • Do not put vias directly on the pad, unless they are capped or plated over. • For parallel modules, tie the VOUT, VFB and COMP pins together. Use an internal layer to closely connect these pins together. • Bring out test points on the signal pins for monitoring. Figure 16givesagoodexampleoftherecommendedlayout. APPLICATIONS INFORMATION Figure 16. Recommended PCB Layout VIN GND GND VOUT 4661 F16 |
Podobny numer części - LTM4661 |
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Podobny opis - LTM4661 |
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