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BTS50025-1TAD Arkusz danych(PDF) 15 Page - Infineon Technologies AG

Numer części BTS50025-1TAD
Szczegółowy opis  Smart High-Side Power Switch
Download  51 Pages
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Producent  INFINEON [Infineon Technologies AG]
Strona internetowa  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

BTS50025-1TAD Arkusz danych(HTML) 15 Page - Infineon Technologies AG

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Data Sheet
15
Rev. 1.1
2017-03-30
BTS50025-1TAD
Smart High-Side Power Switch
General Product Characteristics
4.3
Thermal Resistance
Note:
This thermal data was generated in accordance with JEDEC JESD51 standards. For more
information, go to www.jedec.org.
Figure 7 is showing the typical thermal impedance of BTS50025-1TAD mounted according to JEDEC JESD51-
2,-5,-7 at natural convection on FR4 1s0p and 2s2p boards.
Figure 7
Typical Transient Thermal Impedance Zth(JA) = f(time) for Different PCB Conditions
Table 4
Thermal Resistance
Parameter
Symbol
Values
Unit Note or
Test Condition
Number
Min.
Typ.
Max.
Junction to Case
RthJC
––
0.8
K/W
1)
1) Not subject to production test, specified by design.
P_4.3.1
Junction to Ambient
RthJA(2s2p)
–20
K/W
1)2)
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2×114.3×1.5 mm board with 2 inner copper layers (2×70µm Cu, 2×35µm
Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer. TA = 25°C.
Device is dissipating 2 W power.
P_4.3.2
Junction to Ambient
RthJA
–70
K/W
1)3)
3) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 1s0p board; the Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm board with only one top copper layer 1 × 70 µm. TA =25°C.
Device is dissipating 2 W power.
P_4.3.3
0.01
0.1
1
10
100
0.0001
0.001
0.01
0.1
1
10
100
1000
tPULSE [s]
JEDEC 1s0p / 600mm²
JEDEC 1s0p / 300mm²
JEDEC 1s0p / footprint
JEDEC 2s2p


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