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ST2225A-SS3 Arkusz danych(PDF) 4 Page - List of Unclassifed Manufacturers |
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4 / 12 page ST2225A 點晶科技股份有限公司 SILICON TOUCH TECHNOLOGY INC. LED Display Driver -3- Version:A.025 Die Configuration * Note: SiTI reserves the right to improve the device geometry and manufacturing processes without prior notice. Though these improvements may result in slight geometry changes, they will not affect die electrical characteristics and pad layouts. Wafer Information Material: Silicon with P-Substrate Diameter: 6 inches(≒15cm) Thickness: 12 mils(≒300um) Width of scribe line:100um Malfunctioned die:Marked with red ink or equivalent marking Die Size: 1449.6um * 2614um Pad Size: 100um * 100um Figure 3 OUTPUT BIT 23 OUTPUT BIT 13 OUTPUT BIT 24 OUTPUT BIT 25 OUTPUT BIT 26 OUTPUT BIT 27 OUTPUT BIT 28 OUTPUT BIT 29 VSS OUTPUT BIT 30 OUTPUT BIT 31 OUTPUT BIT 32 OUTPUT BIT 33 OUTPUT BIT 34 OUTPUT BIT 35 OUTPUT BIT 12 OUTPUT BIT 11 OUTPUT BIT 10 OUTPUT BIT 9 OUTPUT BIT 8 OUTPUT BIT 7 VSS OUTPUT BIT 6 OUTPUT BIT 5 OUTPUT BIT 4 OUTPUT BIT 3 OUTPUT BIT 2 OUTPUT BIT 1 (0, 0) |
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