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ADXL320EB Arkusz danych(PDF) 6 Page - Analog Devices |
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ADXL320EB Arkusz danych(HTML) 6 Page - Analog Devices |
6 / 16 page ADXL320 Rev. 0 | Page 6 of 16 tP tL t25°C TO PEAK tS PREHEAT CRITICAL ZONE TL TO TP TIME RAMP-DOWN RAMP-UP TSMIN TSMAX TP TL Figure 3. Recommended Soldering Profile Table 4. Recommended Soldering Profile Profile Feature Sn63/Pb37 Pb-Free Average Ramp Rate (TL to TP) 3°C/s max 3°C/s max Preheat Minimum Temperature (TSMIN) 100°C 150°C Minimum Temperature (TSMAX) 150°C 200°C Time (TSMIN to TSMAX), tS 60 s − 120 s 60 s − 150 s TSMAX to TL Ramp-Up Rate 3°C/s 3°C/s Time Maintained Above Liquidous (TL) Liquidous Temperature (TL) 183°C 217°C Time (tL) 60 s − 150 s 60 s − 150 s Peak Temperature (TP) 240°C + 0°C/−5°C 260°C + 0°C/−5°C Time within 5°C of Actual Peak Temperature (tP) 10 s − 30 s 20 s − 40 s Ramp-Down Rate 6°C/s max 6°C/s max Time 25°C to Peak Temperature 6 min max 8 min max |
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