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MAX2248 Datasheet(Arkusz danych) 2 Page - Maxim Integrated Products

Numer części MAX2248
Szczegółowy opis  1.9GHz Power Amplifier
Pobierz  9 Pages
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Producent  MAXIM [Maxim Integrated Products]
Strona internetowa  http://www.maxim-ic.com
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BIAS, VCC, RFOUT to GND....................................-0.3V to +6V
SHDN, D0, D1 to GND.............................-0.3V to VBIAS + 0.3V
RFIN to GND........................................................-0.7V to +0.7V
RF Input Power (RFIN) ..................................................+10dBm
Input Current (SHDN, D0, D1) ......................... -10mA to +10mA
Continuous Power Dissipation (TA = +70°C)
16-Pin TQFN ..........................................................1176.5mW
Deration above TA = +70°C ....................................14.70mW/°C
Operating Temperature Range........................... -40°C to +85°C
Storage Temperature Range............................ -65°C to +150°C
Soldering Temperature (reflow).......................................+260°C
(Using Typical Application Circuit, VCC = +2.7V to +5V, PRFIN = 0dBm to +4dBm, fRFIN = 1880MHz to 1930MHz, SHDN = VCC,
TA = -40°C to +85°C, Typical values measured at VCC = +3.2V, PRFIN = +3dBm, fRFIN = 1.9GHz, TA = +25°C, unless otherwise noted.
(Note 1))
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DC ELECTRICAL CHARACTERISTICS
Supply Current
(Note 2, Note 3)
D1 = Low, D0 = Low, TA = +25°C, PRFIN = +3dBm,
VCC = 3.2V, fRFIN = 1.9GHz
73
90
mA
D1 = Low, D0 = Low (Note 8)
126
D1 = Low, D0 = High, TA = +25°C, PRFIN = +3dBm,
VCC = 3.2V, fRFIN = 1.9GHz
76
95
D1 = Low, D0 = High (Note 8)
130
D1 = High, D0 = Low, TA = +25°C, PRFIN = +3dBm,
VCC = 3.2V, fRFIN = 1.9GHz
82
105
D1 = High, D0 = Low (Note 8)
150
D1 = High, D0 = High, TA = +25°C, PRFIN = +3dBm,
VCC = 3.2V, fRFIN = 1.9GHz
105
125
D1 = High, D0 = High (Note 8)
202
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
16 TQFN
PACKAGE CODE
T1633+5
Outline Number
21-0136
Land Pattern Number
90-0032
THERMAL RESISTANCE, SINGLE-LAYER BOARD:
Junction to Ambient (θJA)
68°C/W
Junction to Case (θJC)
10°C/W
THERMAL RESISTANCE, FOUR-LAYER BOARD:
Junction to Ambient (θJA)
48°C/W
Junction to Case (θJC)
10°C/W
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package Information
Electrical Characteristics
www.maximintegrated.com
Maxim Integrated │ 2
MAX2248
1.9GHz Power Amplifier




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