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MF-ASML-X Arkusz danych(PDF) 1 Page - Bourns Electronic Solutions

Numer części MF-ASML-X
Szczegółowy opis  Low Ohmic PTC Resettable Fuses
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Producent  BOURNS [Bourns Electronic Solutions]
Strona internetowa  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

MF-ASML-X Arkusz danych(HTML) 1 Page - Bourns Electronic Solutions

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MF-ASML/X Series - Low Ohmic PTC Resettable Fuses
* RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Electrical Characteristics
Model
V max. I max.
Ihold
Itrip
Resistance
Max. Time To Trip
Tripped
Power
Dissipation
Agency Recognition
at 23 °C
at 23 °C Ohms
at 23 °C
Watts at
23 °C
cUL
TÜV
Volts Amps
Amps
Rmin R1max Amps Seconds
Typ.
E174545 R50391579
MF-ASML035/6
6
50
0.35
0.7
0.05
0.85
8.0
0.1
0.5
3
3
MF-ASML050/6
6
50
0.50
1.0
0.04
0.50
8.0
0.1
0.5
3
3
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Storage Condition
Before Opening ............................................... +40 °C max. / 70 % RH max.
After Opening................................................... +40 °C max. / 10 % RH max.
Floor Condition After Opening .............................. Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max.
Passive Aging....................................................... +85 °C, 1000 hours............................................... ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 24 hours ................................. ±30 % typical resistance change
Thermal Shock ..................................................... -40 °C to +85 °C, 20 times.................................... ±30 % typical resistance change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change (Rmin<R<R1max)
Condition A
Moisture Sensitivity Level (MSL) .......................... See Note
ESD Classification - HBM..................................... 6
Test Procedures and Requirements
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.......................................................... Verify dimensions and materials........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C.......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold...................................................... No trip
Trip Cycle Life....................................................... Vmax, Imax, 100 cycles.......................................... No arcing or burning
Trip Endurance..................................................... Vmax, 48 hours ..................................................... No arcing or burning
Solderability.......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage
Features
n
Surface mount packaging for automated assembly
n
Tiny footprint size (0402) and low profile for space-constrained mobile applications
n
Ultra-low resistance, quick response
n
RoHS compliant* and halogen free**
n
Agency recognition:
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov


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