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VLMK33Q2T1-GS08 Arkusz danych(PDF) 6 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
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VLMK33Q2T1-GS08 Arkusz danych(HTML) 6 Page - HK TO-GRACE TECHNOLOGY CO.,LTD. |
6 / 8 page VLMK33.. www.vishay.com Vishay Semiconductors Rev. 2.0, 07-Mar-18 6 Document Number: 81350 For technical questions, contact: LED@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 METHOD OF TAPING / POLARITY AND TAPE AND REEL SMD LED (VLM3-SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. TAPING OF VLM.3.. Fig. 10 - Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS) Fig. 11 - Reel Dimensions - GS08 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS) PREFFERED Fig. 12 - Reel Dimensions - GS18 SOLDERING PROFILE Fig. 13 - Vishay Lead (Pb)-free Reflow Soldering Profile (according to J-STD-020) Fig. 14 - Double Wave Soldering of Opto Devices (all Packages) Adhesive tape Component cavity Blister tape 94 8670 1.85 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8.3 7.7 3.5 3.1 2.2 2.0 0.25 94 8668 180 178 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0 120° 94 8665 Identification Label: Vishay type group tape code production code quantity 321 329 Identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8.4 120° 18857 Label: Vishay type group tape code production code quantity 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19885 IR Reflow Soldering Profile for Lead (Pb)-Free Soldering Preconditioning according to JEDEC level 2a max. 2 cycles allowed 255 °C 948626-1 10 100 1000 10000 0 100 200 300 0 50 100 150 200 250 TTW Soldering (according to CECC00802) Time (s) 50 150 250 2 K/s Second wave Wirst wave 5 s Full line: typical Dotted lines: process limits Lead temperature 235 °C to 260 °C 100 °C to 130 °C ca. 200 K/s Forced cooling ca. 5 K/s ca. 2 K/s |
Podobny numer części - VLMK33Q2T1-GS08 |
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Podobny opis - VLMK33Q2T1-GS08 |
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