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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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HH15N100G500CT Arkusz danych(PDF) 7 Page - WALSIN TECHNOLOGY CORPORATION |
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HH15N100G500CT Arkusz danych(HTML) 7 Page - WALSIN TECHNOLOGY CORPORATION |
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7 / 11 page  Multilayer Ceramic Capacitors Approval Sheet Page 7 of 11 ASC_ HQ_Low ESR_(HH)_006V_AS Dec. 2018 10. RELIABILITY TEST CONDITIONS AND REQUIREMENTS No. Item Test Conditions Requirements 1. Visual and Mechanical --- * No remarkable defect. * Dimensions to conform to individual specification sheet. 2. Capacitance Cap ≤1000pF, 1.0±0.2Vrms, 1MHz±10% Cap>1000pF, 1.0±0.2Vrms, 1KHz±10% At 25°C ambient temperature. * Shall not exceed the limits given in the detailed spec. 3. Q/ D.F. (Dissipation Factor) * NP0: Cap ≥30pF, Q≥1000; Cap<30pF, Q≥400+20C 4. Dielectric Strength * To apply voltage: ( ≤100V ) 250% of rated voltage. * Duration: 1 to 5 sec. * Charge and discharge current less than 50mA. * No evidence of damage or flash over during test. * To apply voltage: 200V~300V ≥2 times VDC 500V~999V ≥1.5 times VDC * Cut-off, set at 10mA * TEST= 15 sec. * RAMP=0 5. Insulation Resistance Rated voltage:<200V To apply rated voltage for max. 120 sec. ≥10G Rated voltage:200~630V To apply rated voltage (500V max.) for 60 sec. ≥10G or RxC≥100 -F whichever is smaller 6. Temperature Coefficient With no electrical load. Operating temperature: -55~125°C at 25°C * Capacitance change: within ±30ppm/°C 7. Adhesive Strength of Termination * Pressurizing force： 2N (0201) and 5N ( ≤0603) and 10N (>0603) * Test time: 10±1 sec. * No remarkable damage or removal of the terminations. 8. Vibration Resistance * Vibration frequency: 10~55 Hz/min. * Total amplitude: 1.5mm * Test time: 6 hrs. (Two hrs each in three mutually perpendicular directions.) * Cap./DF(Q) Measurement to be made after de-aging at 150°C for 1hr then set for 24±2 hrs at room temp. * No remarkable damage. * Cap change and Q/D.F.: To meet initial spec. 9. Solderability * Solder temperature: 235±5°C * Dipping time: 2±0.5 sec. 95% min. coverage of all metalized area. 10. Bending Test * The middle part of substrate shall be pressurized by means of the pressurizing rod at a rate of about 1 mm per second until the deflection becomes 1 mm and then the pressure shall be maintained for 5±1 sec. * Measurement to be made after keeping at room temp. for 24±2 hrs. * No remarkable damage. * Cap change: within ±5.0% or ±0.5pF whichever is larger. (This capacitance change means the change of capacitance under specified flexure of substrate from the capacitance measured before the test.) 11. Resistance to Soldering Heat * Solder temperature: 260±5°C * Dipping time: 10±1 sec * Preheating: 120 to 150°C for 1 minute before imme rse the capacitor in a eutectic solder. * Cap. / DF(Q) / I.R. Measurement to be made after de-aging at 150°C for 1hr then set for 24±2 hrs at room temp . * No remarkable damage. * Cap change: within ±2.5% or ±0.25pF whichever is larger. * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * 25% max. leaching on each edge. |
Podobny numer części - HH15N100G500CT |
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Podobny opis - HH15N100G500CT |
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