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EC103D1W Arkusz danych(PDF) 6 Page - WeEn Semiconductors |
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6 / 13 page WeEn Semiconductors EC103D1W SCR EC103D1W All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved Product data sheet 21 August 2018 6 / 13 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point Fig. 6 - - 15 K/W printed circuit board mounted; minimum pad area; in free air; Fig. 7 - 70 - K/W Rth(j-a) thermal resistance from junction to ambient free air printed circuit board mounted; minimum footprint; in free air; Fig. 8 - 156 - K/W 1 10-1 10 102 Zth(j-sp) (K/W) 10-2 tp (s) 10-5 1 10 10-1 10-2 10-4 10-3 aaa-007701 tp P t Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width |
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