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RTQ2533W Arkusz danych(PDF) 16 Page - Richtek Technology Corporation

Numer części RTQ2533W
Szczegółowy opis  3A, 6.5V, Ultra Low Noise, Ultra Low Dropout Linear Regulator
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Producent  RICHTEK [Richtek Technology Corporation]
Strona internetowa  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RTQ2533W Arkusz danych(HTML) 16 Page - Richtek Technology Corporation

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RTQ2533W
16
DSQ2533W-00 April 2019
www.richtek.com
©
Copyright 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Reverse Current Protection
Reverse current from VOUT to VIN that flows through the
body diode of the pass element instead of the normal
conducting channel can happen if the maximum VOUT
exceeds VIN + 0.3V; in this case, the pass element may
be damaged.
For example, if the output is biased above the input supply
voltage level or the input supply has an instant drop at
light load operation that makes VIN < VOUT. As shown in
Figure 7, an external Schottky diode could be added to
prevent the pass element be damaged from the reverse
current.
Figure 7. Application Circuit for Reverse Current
Protection
Thermal Considerations
Thermal protection limits power dissipation in the
RTQ2533W. When power dissipation on the pass
element (PDIS = (VIN
− VOUT) x IOUT) is too high and raises
the junction operation temperature over 160
°C, the OTP
circuit starts the thermal shutdown function and turns the
pass element off. The pass element turns on again after
the junction temperature cools down by 20
°C.
The output is shorted to ground when there is short circuit
at the output. This procedure can reduce the chip
temperature and provides maximum safety to end users
when output short circuit occurs.
The junction temperature should never exceed the
absolute maximum junction temperature TJ(MAX), listed
under Absolute Maximum Ratings, to avoid permanent
damage to the device. The maximum allowable power
dissipation depends on the thermal resistance of the IC
package, the PCB layout, the rate of surrounding airflow,
and the difference between the junction and ambient
temperatures. The maximum power dissipation can be
calculated using the following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and
θJAis the junction-to-ambient
thermal resistance.
For continuous operation, the maximum operating junction
temperature indicated under Recommended Operating
Conditions is 125
°C. The junction-to-ambient thermal
resistance,
θJA, is highly package dependent. For a VQFN-
20L 3.5x3.5 package, the thermal resistance,
θJA, is
36
°C/W on a high effective-thermal-conductivity four-layer
test board. The maximum power dissipation at TA = 25
°C
can be calculated as below :
PD(MAX) = (125
°C − 25°C) / (36°C/W) = 2.78W for a
VQFN-20L 3.5x3.5 package.
The maximum power dissipation depends on the operating
ambient temperature for the fixed TJ(MAX) and the thermal
resistance,
θJA. The derating curves in Figure 8 allow the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
VOUT
RTQ2533W
GND
VIN
CIN
COUT
Figure 8. Derating Curve of Maximum Power Dissipation
Layout Considerations
For best performance of the RTQ2533W, the PCB layout
suggestions below are highly recommend. All circuit
components placed on the same side and as near to the
respective LDO pin as possible. Place the ground return
path connection to the input and output capacitor. Connect
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB


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