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MC10E195 Arkusz danych(PDF) 2 Page - ON Semiconductor

Numer części MC10E195
Szczegółowy opis  PROGRAMMABLE DELAY CHIP
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
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MC10E195 Arkusz danych(HTML) 2 Page - ON Semiconductor

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MC10E195 MC100E195
MOTOROLA
ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0
°C
25
°C
85
°C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Condition
IIH
Input HIGH Current
150
150
150
µA
IEE
Power Supply Current
10E
100E
130
130
156
156
130
130
156
156
130
150
156
179
mA
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0
°C
25
°C
85
°C
Symbol
Characteristic
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
Notes
tPLH
tPHL
Propagation Delay
IN to Q; Tap = 0
IN to Q; Tap = 127
EN to Q; Tap = 0
D7 to CASCADE
1210
3200
1250
300
1360
3570
1450
450
1510
3970
1650
700
1240
3270
1275
300
1390
3630
1475
450
1540
4030
1675
700
1440
3885
1350
300
1590
4270
1650
450
1765
4710
1950
700
ps
tRANGE
Programmable Range
tPD (max) – tPD (min)
2000
2175
2050
2240
2375
2580
ps
∆t
Step Delay
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
55
115
250
505
1000
17
34
68
136
272
544
1088
105
180
325
620
1190
55
115
250
515
1030
17.5
35
70
140
280
560
1120
105
180
325
620
1220
65
140
305
620
1240
21
42
84
168
336
672
1344
120
205
380
740
1450
ps
6
Lin
Linearity
D1
D0
D1
D0
D1
D0
7
tSKEW
Duty Cycle Skew
tPHL–tPLH
±30
±30
±30
ps
1
ts
Setup Time
D to LEN
D to IN
EN to IN
200
800
200
0
200
800
200
0
200
800
200
0
ps
2
3
th
Hold Time
LEN to D
IN to EN
500
0
250
500
0
250
500
0
250
ps
4
tR
Release Time
EN to IN
SET MAX to LEN
SET MIN to LEN
300
800
800
300
800
800
300
800
800
ps
5
tjit
Jitter
<5.0
<5.0
<5.0
ps
8
tr
tf
Output Rise/Fall Time
20–80% (Q)
20–80% (CASCADE)
125
300
225
450
325
650
125
300
225
450
325
650
125
300
225
450
325
650
ps
1. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
2. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
3. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than
±75 mV to that IN/IN transition.
4. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response
greater than
±75 mV to that IN/IN transition.
5. This release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and transition times.
6. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations of
asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
7. The linearity specification guarantees to which delay control input the programmable steps will be monotonic (i.e. increasing delay steps for
increasing binary counts on the control inputs Dn). Typically the device will be monotonic to the D0 input, however under worst case conditions
and process variation, delays could decrease slightly with increasing binary counts when the D0 input is the LSB. With the D1 input as the LSB
the device is guaranteed to be monotonic over all specified environmental conditions and process variation.
8. The jitter of the device is less than what can be measured without resorting to very tedious and specialized measurement techniques.


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