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GRM1885C2A5R2BA01 Arkusz danych(PDF) 16 Page - Murata Manufacturing Co., Ltd |
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GRM1885C2A5R2BA01 Arkusz danych(HTML) 16 Page - Murata Manufacturing Co., Ltd |
16 / 30 page 4-2.Flow Soldering 1. Do not apply flow soldering to chips not listed in Table 2. [Standard Conditions for Flow Soldering] Table 2 Series GRM 2. When sudden heat is applied to the components, the mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB. Preheating conditions are shown in table 2. It is required to keep the temperature differential between the solder and the components surface [Allowable Flow Soldering Temperature and Time] (ΔT) as low as possible. 3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations. 4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT) between the component and solvent within the range shown in the table 2. Recommended Conditions In the case of repeated soldering, the accumulated soldering time must be within the range shown above. Lead Free Solder: Sn-3.0Ag-0.5Cu 5. Optimum Solder Amount for Flow Soldering 5-1. The top of the solder fillet should be lower than the thickness of the components. If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition. Soldering Peak Temperature 250 to 260℃ Atmosphere Air or N2 Chip Dimension(L/W) Code Temperature Differential 18/21/31 ΔT≦150℃ Lead Free Solder Preheating Peak Temperature 100 to 120℃ Soldering Time(s) 280 270 260 250 240 230 220 0 10 20 40 30 Temperature(℃) Soldering Peak Temperature Preheating Peak Temperature 30 to 90 s Preheating 5 s max. Time Gradual Cooling Soldering ΔT Up to Chip Thickness Adhesive in section GRM1885C2A5R2BA01-01A |
Podobny numer części - GRM1885C2A5R2BA01 |
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Podobny opis - GRM1885C2A5R2BA01 |
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