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GRM188B11E202KA01 Datasheet(Arkusz danych) 18 Page - Murata Manufacturing Co., Ltd

Numer części GRM188B11E202KA01
Szczegółowy opis  Chip Monolithic Ceramic Capacitor for General
Pobierz  30 Pages
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Producent  MURATA1 [Murata Manufacturing Co., Ltd]
Strona internetowa  http://www.murata.com
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 18 page
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4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
     [Standard Conditions for Flow Soldering]
Table 2
Series
GRM
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and
the components surface (ΔT) as low as possible.
3. Excessively long soldering time or high soldering
temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting,
be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range
shown in the table 2.
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of the components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Atmosphere
100 to 120℃
250 to 260℃
Air or N2
Caution
Lead Free Solder
Preheating Peak Temperature
Soldering Peak Temperature
Chip Dimension(L/W) Code
18/21/31
ΔT≦150℃
Temperature Differential
!
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90 seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to Chip Thickness
Adhesive
in section
JEMCGC-2701X
18




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