Zakładka z wyszukiwarką danych komponentów
Selected language     Polish  ▼
Nazwa części
         Szczegóły


GRM188B11E202KA01 Datasheet(Arkusz danych) 20 Page - Murata Manufacturing Co., Ltd

Numer części GRM188B11E202KA01
Szczegółowy opis  Chip Monolithic Ceramic Capacitor for General
Pobierz  30 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Producent  MURATA1 [Murata Manufacturing Co., Ltd]
Strona internetowa  http://www.murata.com
Logo 

 20 page
background image
5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended]
[Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending]
[Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Caution
High
Medium
Medium
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
Low
Level of stress on board
×
△*
△*
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
1A
JEMCGC-2701X
20




Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30 


Datasheet Download




Link URL

Czy Alldatasheet okazała się pomocna?  [ DONATE ]  

O Alldatasheet   |   Reklama   |   Kontakt   |   Polityka prywatności   |   Dodaj do ulubionych   |   Linki   |   Lista producentów
All Rights Reserved© Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  , Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp  |   Russian : Alldatasheetru.com
Korean : Alldatasheet.co.kr   |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com  |   Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl