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LM25183-Q1 Arkusz danych(PDF) 36 Page - Texas Instruments |
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LM25183-Q1 Arkusz danych(HTML) 36 Page - Texas Instruments |
36 / 40 page A A www.ti.com PACKAGE OUTLINE C 8X 0.35 0.25 3 0.05 2X 2.4 1.98 0.05 6X 0.8 0.8 MAX 8X 0.5 0.3 0.05 0.00 A 4.1 3.9 B 4.1 3.9 (0.2) TYP 0.1 MIN (0.05) WSON - 0.8 mm max height NGU0008C PLASTIC SMALL OUTLINE - NO LEAD 4224001/A 11/2017 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED SYMM SYMM 9 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.000 A-A 30.000 SECTION A-A TYPICAL 36 LM25183-Q1 SNVSBJ4 – APRIL 2020 www.ti.com Product Folder Links: LM25183-Q1 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated |
Podobny numer części - LM25183-Q1 |
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Podobny opis - LM25183-Q1 |
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