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TLV197-Q1 Arkusz danych(PDF) 24 Page - Texas Instruments

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Numer części TLV197-Q1
Szczegółowy opis  TLVx197-Q1 Automotive, High-Voltage, Precision, Rail-to-Rail In, Rail-to-Rail Out Op Amp
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

TLV197-Q1 Arkusz danych(HTML) 24 Page - Texas Instruments

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Power Supply
ESD Cell
VSS
VDD
IN±
IN+
+
±
TVS
TVS
VIN
+VS
±VS
TLVx197-Q1
+
±
100
100
R1
RS
RL
RF
24
TLV197-Q1, TLV2197-Q1, TLV4197-Q1
SBOS935 – APRIL 2020
www.ti.com
Product Folder Links: TLV197-Q1 TLV2197-Q1 TLV4197-Q1
Submit Documentation Feedback
Copyright © 2020, Texas Instruments Incorporated
7.3.7 Electrical Overstress
Designers often ask questions about the capability of an operational amplifier to withstand electrical overstress
(EOS). These questions tend to focus on the device inputs, but may involve the supply voltage pins or even the
output pin. Each of these different pin functions have electrical stress limits determined by the voltage breakdown
characteristics of the particular semiconductor fabrication process and specific circuits connected to the pin.
Additionally, internal electrostatic discharge (ESD) protection is built into these circuits to protect them from
accidental ESD events both before and during product assembly.
Having a good understanding of this basic ESD circuitry and its relevance to an electrical overstress event is
helpful. Figure 40 shows an illustration of the ESD circuits contained in the TLVx197-Q1 (indicated by the dashed
line area). The ESD protection circuitry involves several current-steering diodes connected from the input and
output pins and routed back to the internal power-supply lines, where the diodes meet at an absorption device or
the power-supply ESD cell, internal to the operational amplifier. This protection circuitry is intended to remain
inactive during normal circuit operation.
Figure 40. Equivalent Internal ESD Circuitry Relative to a Typical Circuit Application
An ESD event is very short in duration and very high voltage (for example, 1 kV, 100 ns); whereas, an EOS
event is long duration and lower voltage (for example, 50 V, 100 ms). The ESD diodes are designed for out-of-
circuit ESD protection (that is, during assembly, test, and storage of the device before being soldered to the
PCB). During an ESD event, the ESD signal is passed through the ESD steering diodes to an absorption circuit
(labeled ESD power-supply circuit). The ESD absorption circuit clamps the supplies to a safe level.
Although this behavior is necessary for out-of-circuit protection, excessive current and damage is caused if
activated in-circuit. A transient voltage suppressors (TVS) can be used to prevent against damage caused by
turning on the ESD absorption circuit during an in-circuit ESD event. Using the appropriate current limiting
resistors and TVS diodes allows for the use of device ESD diodes to protect against EOS events.


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