FM1020-T THRU FM1040-T

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AB

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.00585 ounce, 0.195 gram

(V)

(V)

(V)

(V)

(

FM1020-T

SS102

20

14

20

FM1030-T

SS103

30

21

30

FM1040-T

SS104

40

28

40

SYMBOLS

MARKING

CODE

-55 to +125

Operating

temperature

*1

*2

*3

*4

0.55

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

See Fig.1

10.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

150

A

25

1.0

mA

50

mA

Thermal resistance

Junction to ambient

55

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

700

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

Chip Schottky Barrier Diodes

Silicon epitaxial planer type

Formosa MS

0.276(7.0)

0.260(6.6)

0.012(0.3) Typ.

0.189(4.8)

0.173(4.4)

0.244(6.2)

0.228(5.8)

0.087(2.2)

0.071(1.8)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMC-T

0.152(3.8)

0.144(3.6)

0.032(0.8) Typ.