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SM6S10A Arkusz danych(PDF) 1 Page - Vishay Siliconix |
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SM6S10A Arkusz danych(HTML) 1 Page - Vishay Siliconix |
1 / 3 page SM6S Series Vishay Semiconductors formerly General Semiconductor Document Number 88384 www.vishay.com 01-Aug-02 1 New Product Surface Mount Automotive Transient Voltage Suppressors Stand-off Voltage 10 to 36V Peak Pulse Power 4600W (10/1000 µs) 3600W (10/10,000 µs) Patented* Maximum Ratings and Thermal Characteristics (TC = 25°C unless otherwise noted) Parameter Symbol Value Unit Peak pulse power dissipation with 10/1000 µs waveform 4600 10/10,000 µs waveform PPPM 3600 W Steady state power dissipation PD 6.0 W Peak pulse current with a 10/1000 µs waveform (NOTE 1) IPPM See Table 1 A Peak forward surge current, 8.3ms single half sine-wave IFSM 600 A Typical thermal resistance junction to case R ΘJC 0.95 °C/W Operating junction and storage temperature range TJ, TSTG –55 to +175 °C Notes: (1) Non-repetitive current pulse derated above TA=25°C 0.093(2.4) 0.116(3.0) 0.059(1.5) 0.098(2.5) 0.098(2.5) 0.138(3.5) 0.366(9.3) 0.343(8.7) 0.406(10.3) 0.382(9.7) 0.342(8.7) 0.327(8.3) 0.413(10.5) 0.374(9.5) 0.539(13.7) 0.524(13.3) LEAD 2/METAL HEATSINK 0.020(0.5) 0.028(0.7) 0.016 (0.4) Min. 0.197(5.0) 0.185(4.7) LEAD 1 0.628(16.0) 0.592(15.0) *Patent #’s: 4,980,315 5,166,769 5,278,095 Features • Ideally suited for load dump protection • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • High temperature stability due to unique oxide passiva- tion and patented PAR ® construction • Integrally molded heatsink provides a very low thermal resistance for maximum heat dissipation • Low leakage current at TJ = 175°C • High temperature soldering guaranteed: 260°C for 10 seconds at terminals • Meets ISO7637-2 surge spec. • Low forward voltage drop 0.413(10.5) 0.374(9.5) 0.366(9.3) 0.343(8.7) 0.606(15.4) 0.583(14.8) 0.150(3.8) 0.126(3.2) 0.091(2.3) 0.067(1.7) 0.116(3.0) 0.093(2.4) Mounting Pad Layout Mechanical Data Case: Molded plastic body, surface mount with heatsink integrally mounted in the encapsulation Terminals: Plated, solderable per MIL-STD-750, Method 2026 Polarity: Heatsink is anode Mounting Position: Any Weight: 0.091 oz., 2.58 g Packaging codes/options: 2D/750 per 13" Reel (16mm Tape), anode towards sprocket hole, 4.5K/box 2E/750 per 13" Reel (16mm Tape), cathode towards sprocket hole, 4.5K/box DO-218AB Dimensions in inches and (millimeters) |
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