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DAC8832 Arkusz danych(PDF) 2 Page - Texas Instruments |
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DAC8832 Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 26 page www.ti.com ABSOLUTE MAXIMUM RATINGS DAC8832 SBAS380A – FEBRUARY 2006 – REVISED APRIL 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) MINIMUM POWER- RELATIVE DIFFERENTIAL ON SPECIFIED TRANSPORT ACCURACY NONLINEARITY RESET TEMPERATURE PACKAGE PACKAGE- PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) VALUE RANGE MARKING LEAD DESIGNATOR NUMBER QUANTITY DAC8832IRGYT Tape and Reel, 250 DAC8832IRGY ±4 ±1 Mid-Code –40 °C to +85°C 8832I QFN-14 RGY DAC8832IRGYR Tape and Reel, 1000 DAC8832IBRGYT Tape and Reel, 250 DAC8832IBRGY ±2 ±1 Mid-Code –40 °C to +85°C 8832I QFN-14 RGY DAC8832IBRGYR Tape and Reel, 1000 DAC8832ICRGYT Tape and Reel, 250 DAC8832ICRGY ±1 ±1 Mid-Code –40 °C to +85°C 8832I QFN-14 RGY DAC8832ICRGYR Tape and Reel, 1000 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com. over operating free-air temperature range (unless otherwise noted)(1) DAC8832 UNIT VDD to AGND –0.3 to +7 V Digital input voltage to DGND –0.3 to +VDD + 0.3 V VOUT to AGND –0.3 to +VDD + 0.3 V AGND, AGNDF, AGNDS to DGND –0.3 to +0.3 V Operating temperature range –40 to +85 °C Storage temperature range –65 to +150 °C Junction temperature range (TJ max) +150 °C Power dissipation (TJ max – TA) / θJA W Thermal impedance, θ JA 54.9 °C/W (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback |
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