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TPA6010A4PWP Arkusz danych(PDF) 2 Page - Texas Instruments |
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TPA6010A4PWP Arkusz danych(HTML) 2 Page - Texas Instruments |
2 / 25 page www.ti.com + − RHPIN R MUX RLINEIN RIN Σ Σ Bass Boost PVDD Power Management VDD PC-BEEP PC BEEP BYPASS SHUTDOWN GND SE/BTL MUX CONTROL HP/LINE ROUT+ RDOCKOUT ROUT− BBOUT BBIN RBB CBB BBENABLE LHPIN L MUX LLINEIN LIN LOUT+ LDOCKOUT LOUT− BUFFGAIN VOLUME DC GAIN and Volume Control BUFFGAIN VOLUME CLK + − + − Σ + − Σ + − + − + − Σ BUFFGAIN VOLUME + − + − + − Σ TPA6010A4 SLOS268B – JUNE 2000 – REVISED AUGUST 2004 The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only in TO-220-type packages. Thermal impedances of approximately 35 °C/W are truly realized in multilayer PCB applications. This allows the TPA6010A4 to operate at full power into 8- Ω loads at ambient temperatures of 85 °C. FUNCTIONAL BLOCK DIAGRAM 2 |
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