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NBSG16VSMNR2 Arkusz danych(PDF) 2 Page - ON Semiconductor

Numer części NBSG16VSMNR2
Szczegółowy opis  2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
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NBSG16VS
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Figure 1. BGA−16 Pinout (Top View)
VEE
D
D
VTD
VEE
VBB
VTD
NC
VCTRL
VEE
VCC
VCC
VMM
VEE
Q
Q
A
B
C
D
12
3
4
VEE
NC VCTRL VEE
VEE VBB VMM
VEE
VCC
Q
Q
VCC
VTD
D
D
VTD
56
7
8
16
15
14
13
12
11
10
9
1
2
3
4
NBSG16VS
Exposed Pad (EP)
Figure 2. QFN−16 Pinout (Top View)
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Description
BGA
QFN
C2
1
VTD
Internal 50
W Termination Pin. See Table 2.
C1
2
D
ECL, CML,
LVCMOS,
LVDS,
LVTTL
Input
Inverted Differential Input. Internal 75 k
W to VEE and 36.5 kW to VCC.
B1
3
D
ECL, CML,
LVCMOS,
LVDS,
LVTTL
Input
Noninverted Differential Input. Internal 75 k
W to VEE.
B2
4
VTD
Internal 50
W Termination Pin. See Table 2.
A1,D1,A4,
D4
5,8,13,16
VEE
Negative Supply Voltage
A2
6
NC
No Connect
A3
7
VCTRL
Output Amplitude Swing Control. Bypass Pin to VCC through 0.1 mF Capacitor.
B3,C3
9,12
VCC
Positive Supply Voltage
B4
10
Q
RSECL
Output
Noninverted Differential Output. Typically Terminated with 50
W to
VTT = VCC − 2 V
C4
11
Q
RSECL
Output
Inverted Differential Output. Typically Terminated with 50
W to VTT = VCC − 2 V
D3
14
VMM
LVCMOS Reference Voltage Output. (VCC − VEE)/2
D2
15
VBB
ECL Reference Voltage Output
N/A
EP
Exposed Pad. (Note 2)
1. The NC pin is electrically connected to the die and must be left open.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
bottom (see case drawing) must be attached to a heat−sinking conduit.
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
is applied then the device will be susceptible to self−oscillation.


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