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CA3227M Arkusz danych(PDF) 2 Page - Intersil Corporation |
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CA3227M Arkusz danych(HTML) 2 Page - Intersil Corporation |
2 / 6 page 2 Absolute Maximum Ratings Thermal Information Collector to Emitter Voltage (VCEO). . . . . . . . . . . . . . . . . . . . . . . 8V Collector to Base Voltage (VCBO) . . . . . . . . . . . . . . . . . . . . . . . 12V Collector to Substrate Voltage (VCIO, Note 1) . . . . . . . . . . . . . . 20V Collector Current (IC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Thermal Resistance (Typical, Note 2) θJA (oC/W) 16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 185 Maximum Power Dissipation (Any One Transistor) . . . . . . . . 85mW Maximum Junction Temperature (Die). . . . . . . . . . . . . . . . . . 175oC Maximum Junction Temperature (Plastic Package). . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The collector of each transistor of these devices is isolated from the substrate by an integral diode. The substrate (Terminal 5) must be connected to the most negative point in the external circuit to maintain isolation between transistors and to provide for normal transistor action. 2. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications TA = 25oC PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS FOR EACH TRANSISTOR Collector to Base Breakdown Voltage V(BR)CBO IC = 10µA, IE = 0 12 20 - V Collector to Emitter Breakdown Voltage V(BR)CEO IC = 1mA, IB = 0 8 10 - V Collector to Substrate Breakdown Voltage V(BR)CIO IC1 = 10µA, IB = 0, IE = 0 20 - - V Emitter Cutoff Current (Note 3) IEBO VEB = 4.5V, IC = 0 - - 10 µA Collector Cutoff Current ICEO VCE = 5V, IB = 0 - - 1 µA Collector Cutoff Current ICBO VCB = 8V, IE = 0 - - 100 nA DC Forward Current Transfer Ratio hFE VCE = 6V IC = 10mA - 110 - IC = 1mA 40 150 - IC = 0.1mA - 150 - Base to Emitter Voltage VBE VCE = 6V IC = 1mA 0.62 0.71 0.82 V Collector to Emitter Saturation Voltage VCE SAT IC = 10mA, IB = 1mA - 0.13 0.50 V Base to Emitter Saturation Voltage VBE SAT IC = 10mA, IB = 1mA 0.74 - 0.94 V NOTE: 3. On small-geometry, high-frequency transistors, it is very good practice never to take the Emitter Base Junction into reverse breakdown. To do so may permanently degrade the hFE. Hence, the use of IEBO rather than V(BR)EBO. These devices are also susceptible to damage by electrostatic discharge and transients in the circuits in which they are used. Moreover, CMOS handling procedures should be employed. CA3227 |
Podobny numer części - CA3227M |
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Podobny opis - CA3227M |
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