FDC602P Rev C(W)

Typical Characteristics

0

1

2

3

4

5

0

3

6

9

12

15

18

Q

g

, GATE CHARGE (nC)

I

V

DS

=-5.0V

-10V

-15V

0

400

800

1200

1600

2000

0

5

10

15

20

-V

DS

, DRAIN TO SOURCE VOLTAGE (V)

C

ISS

C

OSS

C

RSS

f = 1 MHz

V

GS

= 0 V

Figure 7. Gate Charge Characteristics.

Figure 8. Capacitance Characteristics.

0.01

0.1

1

10

100

0.1

1

10

100

-V

DS

, DRAIN-SOURCE VOLTAGE (V)

DC

10s

1s

100ms

100

µs

R

DS(ON)

LIMIT

V

GS

= -4.5V

SINGLE PULSE

JA

T

A

10ms

1ms

10

20

30

40

50

SINGLE PULSE

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum

Power Dissipation.

0.001

0.01

0.1

1

0.00001

0.0001

0.001

0.01

0.1

1

10

100

1000

P(pk)

SINGLE PULSE

0.01

0.02

0.05

0.1

0.2

D = 0.5

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1b.

Transient thermal response will change depending on the circuit board design.