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MC33990DDR2 Arkusz danych(PDF) 4 Page - Freescale Semiconductor, Inc |
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MC33990DDR2 Arkusz danych(HTML) 4 Page - Freescale Semiconductor, Inc |
4 / 16 page Analog Integrated Circuit Device Data 4 Freescale Semiconductor 33990 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit V BAT DC Supply Voltage (1) VBAT -16 to 40 V Input I/O Pins (2) VI/O(CPU) -0.3 to 7.0 V BUS and LOAD Outputs VBUS -2.0 to 16 V ESD Voltage Human Body Model (3) Machine Model (4) VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -65 to 150 °C Operating Ambient Temperature TA -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Peak Package Reflow Temperature During Reflow (5), (6) TPPRT Note 6. °C Thermal Resistance (Junction-to-Ambient) RθJ-A 180 °C/W Notes 1. An external series diode must be used to provide reverse battery protection of the device. 2. SLEEP , TX, RX, and 4X/LOOP are normally connected to a microcontroller. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100 pF, RZAP=1500 Ω). 4. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 Ω). 5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. |
Podobny numer części - MC33990DDR2 |
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Podobny opis - MC33990DDR2 |
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