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DAC8871 Arkusz danych(PDF) 2 Page - Burr-Brown (TI) |
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DAC8871 Arkusz danych(HTML) 2 Page - Burr-Brown (TI) |
2 / 19 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DAC8871 SBAS396 – JUNE 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) MINIMUM RELATIVE DIFFERENTIAL SPECIFIED ACCURACY NONLINEARITY TEMPERATURE PACKAGE PACKAGE- PACKAGE PRODUCT (LSB) (LSB) RANGE MARKING LEAD DESIGNATOR DAC8871B ±1 ±1 –40 °C to +105°C 8871 TSSOP-16 PW DAC8871 ±3 ±1 –40 °C to +105°C 8871 TSSOP-16 PW (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI website at www.ti.com. over operating free-air temperature range (unless otherwise noted). DAC8871 UNIT VDD to GND –0.3 to +7 V Digital input voltage to GND –0.3 to (VDD + 0.3) V AGND to DGND –0.3 to +0.3 V VCC to VSS –0.3 to +39.6 V VCC to AGND –0.3 to +19.8 V VSS to AGND +0.3 to –19.8 V VREFH to VREFL –0.3 to +39.6 V VREFH to AGND –0.3 to +19.8 V VREFL to AGND –19.8 to +17.5 V Operating temperature range –40 to +105 °C Storage temperature range –65 to +150 °C Maximum junction temperature (TJ max) +150 °C Power dissipation (TJ max - TA)/θJA W Thermal impedance, θ JA TSSOP-16 161.4 °C/W (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback |
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