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TC1263-2.5VOATR Arkusz danych(PDF) 3 Page - Microchip Technology

Numer części TC1263-2.5VOATR
Szczegółowy opis  500 mA, Fixed-Output, CMOS LDO with Shutdown
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Producent  MICROCHIP [Microchip Technology]
Strona internetowa  http://www.microchip.com
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TC1263-2.5VOATR Arkusz danych(HTML) 3 Page - Microchip Technology

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© 2005 Microchip Technology Inc.
DS21374C-page 3
TC1263
SHDN Input
SHDN Input High Threshold
VIH
45
——
%VIN
SHDN Input Low Threshold
VIL
——
15
%VIN
ERROR Output (SOIC Only)
Minimum Operating Voltage
VMIN
1.0
V
Output Logic Low Voltage
VOL
——
400
mV
1 mA Flows to ERROR
ERROR Threshold Voltage
VTH
0.95 x VR
—V
ERROR Positive Hysteresis
VHYS
—50
mV
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note
1:
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5:
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
6:
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
7:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TCV
OUT
V
OUTMAX
V
OUTMIN
() 10
6
V
OUT
T
Δ
×
-------------------------------------------------------------------------
=
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 µA, CL = 3.3 µF,
SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
-40
+125
°C
Note 1
Operating Temperature Range
TJ
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances
Thermal Resistance, 5L-DDPAK
θJA
—57
°C/W
Thermal Resistance, 5L-TO-220
θJA
—71
°C/W
Thermal Resistance, 8L-SOIC
θJA
163
°C/W
Note
1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).


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