Zakładka z wyszukiwarką danych komponentów |
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BU2382FV Arkusz danych(PDF) 6 Page - Rohm |
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BU2382FV Arkusz danych(HTML) 6 Page - Rohm |
6 / 7 page BU2382FV Multimedia ICs 6/6 Application example 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DVDD AVDD DVSS AVSS REF_CLK SEL VDD2 OE_CLK1 NT_PAL TEST1 VSS2 CLK1 CLK2 XTAL IN OE_CLK2 XTAL OUT N T : 14.38182MHz PAL : 17.734475MHz H or L H or L H or L H or L CLK2 output CLK1 output Note) The BU2382FV is basically placed on the board. Decoupling capacitance (0.1 µF) need to be placed between Pin1 (VDD2) and Pin2 (VSS2), Pin5 (AVDD) and Pin6 (AVSS), Pin11 (DVSS) and Pin12 (DVDD). To obtain accurate frequency, capacitance (pF) need to be placed between Pin8 (XTAL IN) and Pin6 (AVSS). Pin7 (XTAL OUT) and Pin6 (AVSS). Tantalum capacitance (10 to 100 µF), ferrite beads may need to be placed to prevent power supply drop in certain board's case. To reduce high frequency noise, selected bypass capacitors (<1 Ω at problem high frequency) maybe used for power pin as close to BU2382FV as possible. |
Podobny numer części - BU2382FV |
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Podobny opis - BU2382FV |
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