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SB1050 Arkusz danych(PDF) 1 Page - Pan Jit International Inc. |
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SB1050 Arkusz danych(HTML) 1 Page - Pan Jit International Inc. |
1 / 2 page PAGE . 1 REV.0-MAR.19.2005 DATA SHEET FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O. Flame Retardant Epoxy Molding Compound. • Exceeds environmental standards of MIL-S-19500/228 • Low power loss, high efficiency. • Low forwrd voltge, high current capability • High surge capacity. • For use in low voltage,high frequency inverters free wheeling , and polarlity protection applications. • Pb free product are available : 99% Sn above can meet Rohs environment substance directive request SB1020~SB10150 SCHOTTKY BARRIER RECTIFIERS .196(5.00) .054(1.39) .038(0.96) .419(10.66) .139(3.55) MIN .163(4.16) .045(1.15) .019(0.50) .025(0.65)MAX .1(2.54) .1(2.54) .387(9.85) Unit : inch (mm) TO-220AC VOLTAGE 20 to 150 Volts 10 Amperes CURRENT MECHANICALDATA Case: TO-220AC Molded plastic Terminals: Solder plated, solderable per MIL-STD-202G, Method 208 Polarity: As marked. Standard packaging: Any Weight: 0.08 ounces, 2.24grams. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% R E T E M A R A PL O B M Y S0 2 0 1 B S0 3 0 1 B S0 4 0 1 B S0 5 0 1 B S0 6 0 1 B S0 8 0 1 B S0 0 1 0 1 B S0 5 1 0 1 B SS T I N U e g a tl o V e s r e v e R k a e P t n e r r u c e R m u m i x a M V RRM 0 20 30 40 50 60 80 0 10 5 1V e g a tl o V S M R m u m i x a M V RMS 4 11 28 25 32 46 50 75 0 1V e g a tl o V g n i k c o l B C D m u m i x a M V DC 0 20 30 40 50 60 80 0 10 5 1V ) m m 5 . 9 ( " 5 7 3 . t n e r r u C d r a w r o F e g a r e v A m u m i x a M T t a h t g n e l d a e lc 0 0 1 = OC IAV 0 1A e v a w - e n i s fl a h e l g n i s s m 3 . 8 : t n e r r u C e g r u S d r a w r o F k a e P ) d o h t e m C E D E J ( d a o l d e t a r n o d e s o p m i r e p u s IFSM 0 5 1A , A 0 1 t a e g a tl o V d r a w r o F m u m i x a M V F 5 5 . 05 7 . 05 8 . 02 9 . 0V 5 2 = A T t a t n e r r u C e s r e v e R C D m u m i x a M OC 0 0 1 = A T e g a tl o V g n i k c o l B C D d e t a R OC IR 5 . 0 0 5 A m c n a t s i s e R l a m r e h T l a c i p y Te R θ C J0 . 3 O W / C e g n a R e r u t a r e p m e T e g a r o t S d n a n o it c n u J g n it a r e p O TJ T , STG 5 2 1 + O T 0 5 - OC Note. Both Bonding and Chip structure are available. |
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