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TLP798GA Arkusz danych(PDF) 2 Page - Toshiba Semiconductor

Numer części TLP798GA
Szczegółowy opis  Measurement Instrumentation
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Producent  TOSHIBA [Toshiba Semiconductor]
Strona internetowa  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP798GA Arkusz danych(HTML) 2 Page - Toshiba Semiconductor

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TLP798GA
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
IF
30
mA
Forward current derating (Ta ≥ 25°C)
ΔIF / °C
−0.3
mA / °C
Peak forward current (100 μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Off
−state output terminal voltage
VOFF
400
V
A connection
150
B connection
200
On
−state RMS current
C connection
ION
300
mA
A connection
−1.5
B connection
−2.0
On
−state current derating (Ta ≥ 25°C)
C connection
ΔION / °C
−3.0
mA / °C
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−40~85
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage (AC, 1 min., R.H. ≤ 60%)
(Note 2)
BVS
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 2): Device considered a two
−terminal device: Pins 1, 2 and 3 shorted together, and pins 4, 5 and 6 shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min.
Typ.
Max.
Unit
Supply voltage
VDD
320
V
Forward current
IF
5
7.5
20
mA
On
−state current (A connection)
ION
150
mA
Operating temperature
Topr
−20
80
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
Circuit Connections
A connection
B connection
C connection
1
2
3
6
5
4
LOAD
AC
DC
or
1
2
3
6
5
4
LOAD
DC
1
2
3
6
5
4
LOAD
DC


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