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XX1002-BD-000V Arkusz danych(PDF) 3 Page - Mimix Broadband |
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XX1002-BD-000V Arkusz danych(HTML) 3 Page - Mimix Broadband |
3 / 5 page 2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler Mechanical Drawing Bias Arrangement Page 3 of 5 (Note: Engineering designator is 5DBL0644) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.200 x 0.100 (0.008 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg. Bond Pad #1 (RF In) Bond Pad #2 (Vcc) Bond Pad #3 (RF Out) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. July 2007 - Rev 27-Jul-07 X1002-BD 0.800 (0.031) 1 2 3 0.632 (0.025) 0.300 (0.012) 2.000 (0.079) 0.0 0.0 0.371 (0.015) Vcc RF In RF Out 1 2 3 |
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