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PS9601 Arkusz danych(PDF) 6 Page - NEC |
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PS9601 Arkusz danych(HTML) 6 Page - NEC |
6 / 6 page EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 08/06/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE PS9601, PS9601L RECOMMENDED SOLDERING CONDITIONS INFRARED RAY REFLOW TEMPERATURE PROFILE (1) Precautions in mounting the devices by infrared reflow soldering • Peak reflow temperature 235 ˚C or below (plastic surface temperature) • Reflow time 30 seconds or less (Time period during which the plastic surface temperature is 210 ˚C • Number of reflows Processes One • Flux Rosin flux containing small amount of chlorine (The flux with a max. chlorine content of 0.2 Wt % is recommended.) (2) Precautions in mounting the devices in solder dip method • Temperature 260 ˚C or below • Time 10 seconds or less • Flux Rosin group flux, where the amount of chloride component is small. Time (s) 120 to 160 ßC 60 to 120 s (pre-heat) (Actual heat) to 10 s to 30 s 235 ßC Peak 210 ßC Peak Temperature 230 ºC or Lower |
Podobny numer części - PS9601_01 |
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Podobny opis - PS9601_01 |
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