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TPA0233DGQ Arkusz danych(PDF) 5 Page - Texas Instruments |
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TPA0233DGQ Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 6 page TPA0233 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS278A – JANUARY 2000 – REVISED MARCH 2000 5 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA DGQ (S-PDSO-G10) PowerPAD ™ PLASTIC SMALL-OUTLINE PACKAGE 0,69 0,41 0,25 Thermal Pad (See Note D) 0,15 NOM Gage Plane 4073273/A 04/98 4,98 0,17 6 3,05 4,78 2,95 10 5 3,05 2,95 1 0,27 0,15 0,05 1,07 MAX Seating Plane 0,10 0,50 M 0,25 0 °–6° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. PowerPAD is a trademark of Texas Instruments Incorporated. |
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