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LA56B-EG-S3-PF Arkusz danych(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA56B-EG-S3-PF Arkusz danych(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 7 page LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO. LA56B/EG-S3-PF Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 260° C3sec Max 5° /sec max 260 ° Preheat 60 Seconds Max 0 ° 0 25 ° 120 ° 50 2° /sec max Temp(° C) 2.Wave Soldering Profile Time(sec) 100 150 |
Podobny numer części - LA56B-EG-S3-PF |
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Podobny opis - LA56B-EG-S3-PF |
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