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LA112B-VY9UG.X-1-PF Arkusz danych(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA112B-VY9UG.X-1-PF Arkusz danych(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 7 page Page 5/6 2.Wave Soldering Profile LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) Dip Soldering Preheat: 120 °C Max Preheat time: 60seconds Max Ramp-up 2 °C/sec(max) Ramp-Down:-5 °C/sec(max) Solder Bath:260 °C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) 260 °C3sec Max 150 100 Time(sec) 5 °/sec max 260° Temp( °C) 50 Preheat 2 °/sec max 120° 25° 0° 0 60 Seconds Max Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. PART NO. LA112B/VY9UG.X-1-PF |
Podobny numer części - LA112B-VY9UG.X-1-PF |
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Podobny opis - LA112B-VY9UG.X-1-PF |
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