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AD9148BBPZRL Arkusz danych(PDF) 8 Page - Analog Devices |
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AD9148BBPZRL Arkusz danych(HTML) 8 Page - Analog Devices |
8 / 73 page AD9148 Preliminary Technical Data Rev. PrA | Page 8 of 73 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter With Respect To Rating AVDD33, IOVDD AGND, DGND, CGND −0.3 V to +3.6 V DVDD18, CVDD18 AGND, DGND, CGND −0.3 V to +2.10 V AGND DGND, CGND −0.3 V to +0.3 V DGND AGND, CGND −0.3 V to +0.3 V CGND AGND, DGND −0.3 V to +0.3 V I120, VREF AGND −0.3 V to AVDD33 + 0.3 V OUT1_P, OUT1_N, OUT2_P, OUT2_N, OUT3_P, OUT3_N, OUT4_P, OUT4_N AGND −1.0 V to AVDD33 + 0.3 V A15_P to A0_P, A15_N to A0_N, B15_P to B0_P, B15_N, B0_N DGND −0.3 V to DVDD18 + 0.3 V DCIA_P, DCIA_N, FRAMEA_P, FRAMEA_N, DCIB_P, DCIB_N, FRAMEB_P, FRAMEB_N DGND −0.3 V to DVDD18+ 0.3 V CLK_P, CLK_N, REFCLK_P, REFCLK_N CGND −0.3 V to CVDD18 + 0.3 V CSB, SCLK, SDIO, SDO, TDO, TDI, TCK, TMS, RESETE, IRQE, PLL_LOCK DGND −0.3 V to IOVDD + 0.3 V Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE Typical θJA, θJB, and θJC are specified vs. the number of PCB layers in still air for each package offering Airflow increases heat dissipation effectively reducing θJA and θJB. Table 7. Thermal Resistance Package Type θJA θJB θJC Unit Notes 196-Ball CSP_BGA 24.7 12.6 5.7 °C/W 4-layer board, 25 PCB vias 19.2 10.9 5.3 °C/W 8-layer board, 25 PCB vias 18.1 10.5 5.3 °C/W 10-layer board, 25 PCB vias 18.0 10.5 5.3 °C/W 12-layer board, 25 PCB vias 196-Ball BGA_EP 20.9 8.6 3.1 °C/W 4-layer board, 25 PCB vias 16.2 7.7 3.1 °C/W 8-layer board, 25 PCB vias 15.2 7.4 3.1 °C/W 10-layer board, 25 PCB vias 15.0 7.4 3.1 °C/W 12-layer board, 25 PCB vias MAXIMUM SAFE POWER DISSIPATION The maximum junction temperature for the AD9148 is 125°C. With the thermal resistance of the molded package (CSP_BGA) given for a 12 layer board, the maximum power that can be dissipated in this package can be calculated as ( ) ( ) W T T Power JA A J MAX 22 . 2 0 . 18 85 125 = − = θ − = To increase the maximum power, the AD9148 is available in a second package option (BGA_EP) which includes a heat spreader on top of the package. Also, an external heat sink can be attached to the top of the AD9148 CSP_BGA package. The adjusted maximum power for each of these conditions is shown in Table 8. With the thermal resistance of the heat spreader package (BGA_EP) given for a 12 layer board, the maximum power that can be dissipated in this package can be calculated as ( ) ( ) W T T Power JA A J MAX 67 . 2 0 . 15 85 125 = − = θ − = To increase the maximum power, an external heat sink can be attached to the top of the AD9148 BGA_EP package. The adjusted maximum power for an external heat sink is shown in Table 8. To aid in the selection of package, the maximum fDAC rate for a given power dissipation over several operating conditions is shown in Table 9. The maximum fDACrate applies to all interpolation rates. Note that if the programmable inverse sinc filter is enabled the maximum fDAC rate specified in Table 9 decreases. ESD CAUTION |
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