TS600-170 datasheet(1/1 Pages) ETC2

Numer części	TS600-170

Szczegółowy opis	PolySwitch Surface-mount Resettable Devices

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192 PolySwitch Surface-mount Resettable Devices

Raychem Circuit Protection

4

Table S3. Electrical Characteristics for Surface-mount Devices continued

I

H

I

T

V

MAX

I

MAX

P

D TYP

Max. Time-to-Trip

R

MIN

R

TYP

R

1 MAX

Figures for

Part Number

(A)

(V

DC)

(A)

(W)

(A)

(s)

(

Ω)(Ω)(Ω)

Dimensions

miniSMD continued

Size 4532 mm/1812 mils

miniSMDM200F*

†

2.00

3.50

8

40

0.6

8.0

3.00

0.020

0.040

0.060

S5

miniSMDC260

2.60

5.00

6

40

0.6

8.0

7.00

0.015

0.035

0.047

S3

miniSMDM260

†

2.60

4.55

6

40

0.6

8.0

6.00

0.010

0.030

0.043

S5

miniSMDM260F*

†

2.60

4.55

6

40

0.6

8.0

6.00

0.010

0.030

0.043

S5

miniSMDE

Size 11550 mm/4420 mils

miniSMDE190

1.90

3.80

16

100

1.4

10

2.0

0.024

0.065

0.080

S3

midSMD

Size 5050 mm/2018 mils

SMD030-2018

0.30

0.80

60

20

0.7

1.5

0.500

1.40

2.300

S6

SMD050-2018

0.55

1.20

57

10

1.0

2.5

5.0

0.200

—

1.000

S6

SMD100-2018

1.10

2.20

15

40

1.2

8.0

0.5

0.100

0.25

0.400

S6

SMD150-2018

1.50

3.00

15

40

1.4

8.0

1.0

0.070

0.13

0.180

S6

SMD200-2018

2.00

4.20

6

40

1.4

8.0

3.0

0.048

0.07

0.100

S6

SMD

Size 7555 mm/2920 mils

SMD030

0.30

0.60

60

10

1.5

3.0

1.200

3.00

4.800

S7

SMD050

0.50

1.00

60

10

1.5

2.5

4.0

0.350

0.87

1.400

S7

SMD075

0.75

1.50

30

40

1.5

8.0

0.3

0.350

0.67

1.000

S7

SMD075F*

0.75

1.50

30

40

1.5

8.0

0.3

0.350

0.67

1.000

S7

SMD100

1.10

2.20

30

40

1.5

8.0

0.5

0.120

0.30

0.480

S7

SMD100/33

1.10

2.20

33

40

1.5

8.0

0.5

0.120

0.27

0.410

S7

SMD125

1.25

2.50

15

40

1.5

8.0

2.0

0.070

0.16

0.250

S7

SMD260

2.60

5.20

6

40

1.5

8.0

20.0

0.025

0.05

0.075

S7

SMD260-RB

2.60

5.00

6

40

1.5

5.0

60.0

0.030

0.055

0.075

S7

SMD300

3.00

6.00

6

40

1.3

8.0

35.0

0.015

0.033

0.048

S7

SMD2

Size 8763 mm/3425 mils

SMD150

1.50

3.00

15

40

1.7

8.0

5.0

0.060

0.16

0.250

S7

SMD150/33

1.50

3.00

33

40

1.7

8.0

5.0

0.080

0.15

0.230

S7

SMDH160

1.60

3.20

16

70

2.1

8.0

15.0

0.050

0.10

0.150

S7

SMD185

1.80

3.60

33

40

1.2

8.0

5.0

0.065

0.12

0.165****

S7

SMD200

2.00

4.00

15

40

1.7

8.0

12.0

0.050

0.09

0.125

S7

SMD250

2.50

5.00

15

40

1.7

8.0

25.0

0.035

0.06

0.085

S7

Telecom Surface-mount**

TSL250-080

0.08

0.16

250***

3.0

1.2

1.0

1.8

5.0

11.0

20.0****

S7

TS250-130

0.13

0.26

250***

3.0

1.1

1.0

2.5

6.5

12.0

20.0

S8

650

1.1

TSV250-130

0.13

0.26

250***

3.0

1.5

1.0

3.0

4.0

7.0

12.0****

S10

TS600-170

0.17

0.40

600***

3.0

2.5

1.0

21.0

4.0

9.0

18.0

S9

TS600-200-RA

0.20

0.40

600***

3.0

2.5

1.0

21.0

4.0

7.5

13.5

S9

TSM600-250

0.25

0.86

600***

3.0

2.0

3.0

6.0

1.0

3.5

7.0

—

TSM600-250-RA

0.25

0.86

600***

3.0

2.0

3.0

6.0

1.0

3.0

5.0

—

*F: lead-free device

†Electrical characteristics determined at 25°C.

**These products are intended for telecom applications. Time-to-trip is typical, please see Telecom and Networking section for details.

***RMS max. voltage.

****R1 MAX is measured one hour post-trip or 24 hours post-reflow at 20°C.

IH = Hold current: maximum current device will pass without interruption in 20°C still air.

IT = Trip current: minimum current that will switch the device from low resistance to high resistance in 20°C still air.

VMAX = Maximum voltage device can withstand without damage at rated current.

IMAX = Maximum fault current device can withstand without damage at rated voltage.

PD = Power dissipated from device when in the tripped state in 20°C still air.

R1 MAX is measured one hour post reflow.

RTYP = Typical resistance of device as supplied at 20°C unless otherwise specified.

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