BZX100A_1

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 01 — 30 May 2007

3 of 10

NXP Semiconductors

BZX100A

Single Zener diode

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

[4]

Soldering point of cathode tab.

(3) FR4 PCB, standard footprint

Fig 1.

Power derating curves

−75

175

125

25

75

−25

006aab047

0.4

0.8

1.2

(W)

0

(1)

(2)

(3)

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to ambient

in free air

[1] -

-

400

K/W

[2] -

-

230

K/W

[3] -

-

125

K/W

thermal resistance from

junction to solder point

[4] --55

K/W