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BZX100A Arkusz danych(PDF) 3 Page - NXP Semiconductors |
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BZX100A Arkusz danych(HTML) 3 Page - NXP Semiconductors |
3 / 10 page BZX100A_1 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 01 — 30 May 2007 3 of 10 NXP Semiconductors BZX100A Single Zener diode 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. [4] Soldering point of cathode tab. (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for cathode 1 cm2 (3) FR4 PCB, standard footprint Fig 1. Power derating curves Tamb (°C) −75 175 125 25 75 −25 006aab047 0.4 0.8 1.2 Ptot (W) 0 (1) (2) (3) Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 400 K/W [2] - - 230 K/W [3] - - 125 K/W Rth(j-sp) thermal resistance from junction to solder point [4] --55 K/W |
Podobny numer części - BZX100A |
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Podobny opis - BZX100A |
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