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TDA18273HN Arkusz danych(PDF) 4 Page - NXP Semiconductors |
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4 / 8 page TDA18273HN_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Preliminary data sheet Rev. 2 — 15 December 2010 4 of 8 NXP Semiconductors TDA18273HN Hybrid Silicon Tuner for terrestrial and cable TV reception 6. Limiting values [1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction temperature is never exceeded. The junction temperature: Tj = Tamb + Tj-c. where Tj-c = power Rth. [2] Class III: 500 V to 1000 V. 7. Abbreviations Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage 0.3 +3.6 V VI input voltage VCC <3.3 V 0.3 VCC +0.3 V VCC >3.3 V 0.3 +3.6 V Tstg storage temperature 40 +150 C Tj junction temperature - 125 C Tamb ambient temperature 20 [1] C VESD electrostatic discharge voltage EIA/JESD22-A114 (HBM) 2+2 kV EIA/JESD22-C101-C (FCDM) class III[2] 750 - V Table 4. Abbreviations Acronym Description AGC Automatic Gain Control AGCK Automatic Gain Control step Killer CB Citizen Band DVB Digital Video Broadcasting DVB-T/T2/C/C2/H DVB-Terrestrial/Terrestrial second generation/Cable/Handheld FCDM Field-induced Charged-Device Model FRAC-N Fractional-N HBM Human Body Model IF Intermediate Frequency IR Image Rejection LNA Low-Noise Amplifier LO Local Oscillator PCB Printed Circuit Board PLD Power Level Detector RF Radio Frequency RoHS Restriction of Hazardous Substances SAW Surface Acoustic Wave UHF Ultra High Frequency VHF Very High Frequency VSYNC Vertical SYNChronization Xtal Crystal |
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