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Z0 Arkusz danych(PDF) 6 Page - Superworld Electronics

Numer części Z0
Szczegółowy opis  FERRITE CHIP BEADS
Download  9 Pages
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Producent  SUPERWORLD [Superworld Electronics]
Strona internetowa  http://www.superworld.com.sg
Logo SUPERWORLD - Superworld Electronics

Z0 Arkusz danych(HTML) 6 Page - Superworld Electronics

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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
9. SOLDERING AND MOUNTING :
soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown
seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave
9-2.2 Solder Wave :
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
9-1. Recommended PC Board Pattern
air soldering tools.
9-2.3 Soldering Iron (Figure 3) :
9-2.1 Lead Free Solder Re-flow :
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
Recommended temperature profiles for re-flow soldering in Figure 1.
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a) Preheat circuit and products to 150°C.
b) 350°C tip temperature (max)
c) Never contact the ceramic with the iron tip
a soldering iron must be employed the following precautions are recommended.
Note :
9-2. Soldering
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
d) 1.0mm tip diameter (max)
under mechanical stress as warping the board.
the mechanical stress to prevent failure.
Products shall be positioned in the sideway direction against
PC board should be designed so that products are not sufficient
0.80
0.30
in Fig. 2
480s max.
Figure 2. Wave Soldering
Over 2min.
Figure 1. Re-flow Soldering
Time(sec.)
60~180s
25
217
200
150
60~150s
Figure 3. Hand Soldering
Over 1min.
150
Gradual
Cooling
Soldering
330
350
Preheating
Natural
(max.)
(max.)
10s
3s
cooling
245
150
Gradual
Cooling
Within 10s
Natural
cooling
Preheating
TP(260°C/10s max.)
20~40s
Soldering
260
Preheating
Natural
cooling
Soldering
11.08.2010
FERRITE CHIP BEADS
Z0 SERIES
NOTE : Specifications subject to change without notice. Please check our website for latest information.


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