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SM5S33 Arkusz danych(PDF) 4 Page - Vishay Siliconix |
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SM5S33 Arkusz danych(HTML) 4 Page - Vishay Siliconix |
4 / 5 page www.vishay.com For technical questions within your region, please contact one of the following: Document Number: 88382 189 DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com Revision: 18-Apr-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SM5S10 thru SM5S36A Vishay General Semiconductor Fig. 5 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters) RθJC 0.01 0.1 1 10 100 100 10 1 0.1 0.01 t - Pulse Width (s) RθJA DO-218AB Mounting Pad Layout 0.413 (10.5) 0.374 (9.5) 0.091 (2.3) 0.067 (1.7) 0.116 (3.0) 0.093 (2.4) 0.150 (3.8) 0.126 (3.2) 0.366 (9.3) 0.343 (8.7) 0.606 (15.4) 0.583 (14.8) 0.116 (3.0) 0.093 (2.4) 0.628 (16.0) 0.592 (15.0) 0.539 (13.7) 0.524 (13.3) 0.366 (9.3) 0.343 (8.7) 0.406 (10.3) 0.382 (9.7) 0.342 (8.7) 0.327 (8.3) 0.413 (10.5) 0.374 (9.5) 0.028 (0.7) 0.020 (0.5) 0.138 (3.5) 0.098 (2.5) Lead 1 0.098 (2.5) 0.059 (1.5) Lead 2/Metal Heatsink 0.197 (5.0) 0.185 (4.7) 0.016 (0.4) MIN. |
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