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Z0107NN,135 Arkusz danych(PDF) 6 Page - NXP Semiconductors |
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Z0107NN,135 Arkusz danych(HTML) 6 Page - NXP Semiconductors |
6 / 14 page Z0107NN All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 05 — 22 March 2011 6 of 14 NXP Semiconductors Z0107NN 4Q Triac 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point full cycle; see Figure 7 --15 K/W Rth(j-a) thermal resistance from junction to ambient full cycle; printed circuit board mounted; minimum footprint; see Figure 6 - 156 - K/W full cycle; printed circuit board mounted; pad area; see Figure 6 -70 - K/W All dimensions are in mm Fig 6. Minimum footprint SOT223 Fig 7. Transient thermal impedance from junction to solder point as a junction of pulse width 001aab508 3.8 min 1.5 min 1.5 min (3 ×) 2.3 4.6 6.3 1.5 min 003aac210 10 -2 10 -1 1 10 10 2 10 -5 10 -4 10 -3 10 -2 1 10 tp (s) Z th(j-sp) (K/W) tp P t 10 -1 |
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