AD5320BRM datasheet(3/12 Pages) AD

Numer części	AD5320BRM

Szczegółowy opis	2.7 V to 5.5 V, 140 uA, Rail-to-Rail Output 12-Bit DAC in a SOT-23

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AD5320

–3–

REV. B

TIMING CHARACTERISTICS1, 2

Limit at TMIN, TMAX

Parameter

VDD = 2.7 V to 3.6 V

VDD = 3.6 V to 5.5 V

Unit

Conditions/Comments

t1

3

50

33

ns min

SCLK Cycle Time

t2

13

ns min

SCLK High Time

t3

22.5

13

ns min

SCLK Low Time

t4

0

ns min

SYNC to SCLK Rising Edge Setup Time

t5

5

ns min

Data Setup Time

t6

4.5

ns min

Data Hold Time

t7

0

ns min

SCLK Falling Edge to

SYNC Rising Edge

t8

50

33

ns min

Minimum

SYNC High Time

NOTES

1All input signals are specified with tr = tf = 5 ns (10% to 90% of V

DD) and timed from a voltage level of (VIL + VIH)/2.

2See Figure 1.

3Maximum SCLK frequency is 30 MHz at V

DD = +3.6 V to +5.5 V and 20 MHz at VDD = +2.7 V to +3.6 V.

Specifications subject to change without notice.

SCLK

SYNC

DIN

t1

t2

t3

t5

t6

t7

t8

t4

DB15

DB0

Figure 1. Serial Write Operation

(VDD = +2.7 V to +5.5 V; all specifications TMIN to TMAX unless otherwise noted)

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Digital Input Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V

VOUT to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . –40

°C to +105°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature (TJ Max) . . . . . . . . . . . . . . . . . +150

°C

SOT-23 Package

Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ Max–TA)/

θ

JA

θ

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 240

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

µSOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW

Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ Max–TA)/

θ

JA

θ

JA Thermal Impedance

. . . . . . . . . . . . . . . . . . . . 206

°C/W

θ

JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability.

ORDERING GUIDE

Temperature

Branding

Package

Model

Range

Information Options*

AD5320BRT

–40

°C to +105°C

D4B

RT-6

AD5320BRM

–40

°C to +105°C

D4B

RM-8

*RT = SOT-23; RM =

µSOIC.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD5320 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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