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AD8005AR Arkusz danych(PDF) 4 Page - Analog Devices |
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AD8005AR Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 12 page AD8005 –4– REV. A ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V Internal Power Dissipation 2 Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . 1.3 Watts Small Outline Package (R) . . . . . . . . . . . . . . . . . . 0.75 Watts SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . 0.5 Watts Input Voltage (Common Mode) . . . . . . . . . . . . . . . ±V S ± 1V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±3.5 V Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range N, R & RT Package . . . . . . . . . . . . . . . . . –65 °C to +125°C Operating Temperature Range (A Grade) . . . –40 °C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-Lead Plastic DIP Package: θ JA = 90°C/W 8-Lead SOIC Package: θ JA = 155°C/W 5-Lead SOT-23 Package: θ JA = 240°C/W CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8005 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8005 is limited by the associated rise in junction tempera- ture. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition tem- perature of the plastic, approximately +150 °C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175 °C for an extended period can result in device failure. While the AD8005 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction tem- perature (+150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves shown in Figure 3. AMBIENT TEMPERATURE – °C 90 80 2.0 1.0 0 1.5 0.5 8-LEAD PLASTIC-DIP PACKAGE –50 TJ = +150°C 70 60 50 40 30 20 10 0 –40 –30 –20 –10 8-LEAD SOIC PACKAGE 5-LEAD SOT-23 PACKAGE Figure 3. Maximum Power Dissipation vs. Temperature WARNING! ESD SENSITIVE DEVICE ORDERING GUIDE Temperature Package Package Brand Model Range Description Option Code AD8005AN –40 °C to +85°C 8-Lead Plastic DIP N-8 AD8005AR –40 °C to +85°C 8-Lead Plastic SOIC SO-8 AD8005AR-REEL –40 °C to +85°C 13" Tape and Reel SO-8 AD8005ART-REEL –40 °C to +85°C 13" Tape and Reel RT-5 H1A AD8005AR-REEL7 –40 °C to +85°C 7" Tape and Reel SO-8 AD8005ART-REEL7 –40 °C to +85°C 7" Tape and Reel RT-5 H1A |
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