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AD8019ARU-EVAL Arkusz danych(PDF) 4 Page - Analog Devices |
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AD8019ARU-EVAL Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 20 page REV. 0 AD8019 –4– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8019 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26.4 V Internal Power Dissipation TSSOP-14 Package 2 . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 W SOIC-8 Package 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 W Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . . ±V S Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . ±VS Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range . . . . . . . . . . . . –65 °C to +125°C Operating Temperature Range . . . . . . . . . . . –40 °C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device on a four-layer board with 10 inches2 of 1 oz. copper at 85 °C 14-lead TSSOP package: θ JA = 90 °C/W. 3Specification is for device on a four-layer board with 10 inches2 of 1 oz. copper at 85 °C 8-lead SOIC package: θ JA = 100 °C/W. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8019 is limited by the associated rise in junction temperature. The maximum safe junction temperature for a plastic encapsulated device is determined by the glass transition temperature of the plastic, approximately 150 °C. Temporarily exceeding this limit may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. The output stage of the AD8019 is designed for maximum load current capability. As a result, shorting the output to common can cause the AD8019 to source or sink 500 mA. To ensure proper operation, it is necessary to observe the maximum power derating curves. Direct connection of the output to either power supply rail can destroy the device. AMBIENT TEMPERATURE – C 2.5 2.0 1.5 1.0 0.5 0 –40 –30 –20 –10 010 20 30 40 50 60 70 80 SOIC TSSOP Figure 2. Plot of Maximum Power Dissipation vs. Temperature for AD8019 for TJ = 150 °C ORDERING GUIDE Temperature Package Package Model Range Description Option AD8019ARU –40 °C to +85°C 14-Lead TSSOP RU-14 AD8019ARU-Reel –40 °C to +85°C 14-Lead TSSOP RU-14 Reel AD8019ARU-EVAL –40 °C to +85°C Evaluation Board ARU-EVAL AD8019AR –40 °C to +85°C 8-Lead SOIC R-8 AD8019AR-Reel –40 °C to +85°C 8-Lead SOIC R-8 Reel AD8019AR-EVAL –40 °C to +85°C Evaluation Board AR EVAL |
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