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AD9000SE Arkusz danych(PDF) 4 Page - Analog Devices

Numer części AD9000SE
Szczegółowy opis  High Speed 6-Bit A/D Converter
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

AD9000SE Arkusz danych(HTML) 4 Page - Analog Devices

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AD9000
–4–
REV. A
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD9000 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DIE LAYOUT
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . 129
× 217 × 15 (±2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
× 4 mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –VS
Passivation . . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil Aluminum; Ultrasonic Bonding
or 1 mil Gold; Gold Ball Bonding
ORDERING GUIDE
1
Temperature
Package
Device
Range
Description
Option
2
AD9000JD
0
°C to +70°C
16-Pin DIP, Industrial
D-16
AD9000SD
–55
°C to +125°C
16-Pin DIP
D-16
AD9000SE
–55
°C to +125°C
28-Pin LCC
E-28A
NOTES
1MIL-STD-883 versions available, contact factory.
2D = Ceramic DIP; E = Leadless Ceramic Chip Carrier.
PIN DESIGNATIONS
PIN DESCRIPTIONS
Pin Name
Description
–VS
Negative supply terminal, nominally –5.2 V.
ANALOG GROUND
Analog ground return. All grounds should be connected together near the AD9000.
VH
The hysteresis control voltage varies the comparator hysteresis from 15 mV to 50 mV, for a change of 0 V
to +3 V at the hysteresis control pin.
ENCODE
The ENCODE pin controls the conversion cycle. Encode is rising edge sensitive and should be driven
with a 50% duty-cycle waveform under normal conditions.
–VREF
The most negative reference voltage for the internal resistor ladder.
AIN
Analog input pin.
+VS
Positive supply terminal, nominally +5.0 V.
+VREF
Most positive reference voltage of the internal resistor ladder.
BIT 6 (LSB)
One of six digital outputs. BIT 6 (LSB) is the least-significant-bit of the digital output.
BIT 5 – BIT 2
One of six digital outputs.
BIT 1 (MSB)
One of six digital outputs. BIT 1 (MSB) is the most-significant-bit of the digital output.
OVERFLOW
Overflow data output. Logic high indicates an input overvoltage (AIN ≥ +VREF).
DIGITAL GROUND
Digital ground return. All grounds should be connected together near the AD9000.


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